OEM ODM Gold Bonding IC Package Substrate 4 Layer

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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City: Shenzhen

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OEM ODM Gold Bonding IC Package Substrate 4 Layer

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OEM ODM Gold Bonding IC Package Substrate 4 Layer

Application:IC substrate,IC packge pcb,IC/chip assembly,Memory card,TF card,UDP,SD card;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC ...

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IC Package Substrate PCB 4 Layer

ODM IC Package Substrate

OEM IC Package Substrate

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