0.26mm memory substrate fabrication with soft gold plating

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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0.26mm memory substrate fabrication with soft gold plating

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0.26mm memory substrate fabrication with soft gold plating

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.26mm; Material brand:Mainly ...

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Complex Gold Finger Pcb

High Precision Gold Finger Pcb

Complex Goldfinger Circuit Board

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